sputter-removing

См. также в других словарях:

• Sputtering — is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. It is commonly used for thin film deposition, etching and analytical techniques (see below). Physics of sputtering Physical… …   Wikipedia

• Surface finishing — is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property.[1] Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion resistance,… …   Wikipedia

• Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …   Wikipedia

• Electron beam lithography — (often abbreviated as e beam lithography) is the practice of scanning a beam of electrons in a patterned fashion across a surface covered with a film (called the resist),cite book |last= McCord |first=M. A. |coauthors=M. J. Rooks |title=… …   Wikipedia

• Anti-reflective coating — Many coatings consist of transparent thin film structures with alternating layers of contrasting refractive index. Layer thicknesses are chosen to produce destructive interference in the beams reflected from the interfaces, and constructive… …   Wikipedia

• Parts cleaning — is essential to many industrial processes, as a prelude to surface finishing or to protect sensitive components. Electroplating is particularly sensitive to part cleanliness, since molecular layers of oil can prevent adhesion of the coating. ASTM …   Wikipedia

• Carbon nanotubes in photovoltaics — Organic photovoltaic devices (OPVs) are fabricated from thin films of organic semiconductors, such as polymers and small molecule compounds, and are typically on the order of 100 nm thick. Because polymer based OPVs can be made using a coating… …   Wikipedia