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1 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder -
2 circuit
схема; коло; контур (див. т-ж chip, integration) - air-isolation integrated circuit
- all-diffused circuit
- aluminum-gate MOS circuit
- aluminum-gate circuit
- amplifier integrated circuit
- analog integrated circuit
- AND circuit
- AND-OR circuit
- application specific integrated circuit
- array integrated circuit
- asymmetric-chevron bubble circuit
- asymmetric-chevron circuit
- basic circuit
- beam-leaded integrated circuit
- beam-lead integrated circuit
- bipolar circuit
- bipolar-FET integrated circuit
- breadboard circuit
- built-in self-checking monitoring circuit
- bulk-effect integrated circuit
- catalogue integrated circuit
- ceramic-encapsulated integrated circuit
- charge-coupled device circuit
- charge-coupled circuit
- charge-domain integrated circuit
- charge pumping circuit
- charge-transfer device circuit
- charge-transfer circuit
- chip integrated circuit
- CMOS circuit
- commodity integrated circuit
- common-base circuit
- common-collector circuit
- common-emitter circuit
- compatible integrated circuit
- complementary integrated circuit
- complex integrated circuit
- control integrated circuit
- crosspoint integrated circuit
- current mirror integrated circuit
- custom integrated circuit
- customized integrated circuit
- custom-wired integrated circuit
- Darlington-typecircuit
- Darlingtoncircuit
- dead-on-arrival integrated circuit
- dedicated -design circuit
- dedicated circuit
- depletion-mode integrated circuit
- die integrated circuit
- dielectrically-isolated integrated circuit
- digital integrated circuit
- digital sequential circuit
- diode-array integrated circuit
- discrete-chip integrated circuit
- discrete-component circuit
- discrete Fourier transform integrated circuit
- discrete integrated circuit
- distributed-element equivalent circuit
- domain-originated integrated circuit
- dry-processed integrated circuit
- dual in-line integrated circuit
- ECL circuit
- EFL integrated circuit
- elevated-electrode integrated circuit
- encapsulated integrated circuit
- enchancement-mode integrated circuit
- epitaxial integrated circuit
- epitaxial passivated integrated circuit
- equivalent circuit
- face-down integrated circuit
- fanout-free circuit
- fault-free circuit
- fault-tolerant circuit
- faulty circuit
- field-effect transistor integrated circuit
- field-effect integrated circuit
- field-programmable logic integrated circuit
- film-mounted integrated circuit
- fine-line integrated circuit
- fine-pattern integrated circuit
- flat-pack integrated circuit
- flip-chip integrated circuit
- flip-flop circuit
- front-end circuit
- full-custom integrated circuit
- functional integrated circuit
- gang-bonding integrated circuit
- gate-equivalent circuit
- governor integrated circuit
- guard-ring isolated integrated circuit
- Gunn-effect integrated circuit
- heterointegrated circuit
- high-density integrated circuit
- highly integrated circuit
- high-performance circuit
- high-speed integrated circuit
- high-technology integrated circuit
- high-threshold logic circuit
- high-volume circuit
- home-grown integrated circuit
- homointegrated circuit
- hybrid circuit
- hybrid dielectric integrated circuit
- hybrid film [hybrid-type] circuit
- I2L circuit
- infra-red integrated circuit
- insulated-substrate integrated circuit
- integrated circuit
- interface circuit
- isoplanar-based integrated circuit
- Josephson-junctioncircuit
- Josephsoncircuit
- ion-implanted integrated circuit
- junction isolated integrated circuit
- known-good circuit
- ladder-like circuit
- ladder circuit
- laminated integrated circuit
- large-scale integrated circuit
- leading-edge integrated circuit
- linear integrated circuit
- LOCOS integrated circuit
- logic integrated circuit
- low-noise circuit
- low-profile integrated circuit
- LSI circuit
- lumped-element equivalent circuit
- made-to-order integrated circuit
- master-slice integrated circuit
- matrix integrated circuit
- megascale integrated circuit
- MOSBIP integrated circuit
- memory circuit
- merchant integrated circuit
- merged integrated circuit
- microelectronic circuit
- Micronor integrated circuit
- micron-scale integrated circuit
- microprocessor integrated circuit
- molecular integrated circuit
- monobrid circuit
- monolithic circuit
- MOS-transistor circuit
- MOS circuit
- MSI circuit
- multichip circuit
- multilayer integrated circuit
- multilevel integrated circuit
- multiple-chip circuit
- naked integrated circuit
- NAND circuit
- noise-immunity integrated circuit
- nonredundant integrated circuit
- NOR circuit
- off-the-shelf integrated circuit
- one-chip integrated circuit
- one-mask integrated circuit
- open-collector integrated circuit
- optical integrated circuit
- optoelectronic integrated circuit
- OR circuit
- oxide-isolated integrated circuit
- partially self-checking circuit
- photo-integrated circuit
- photonic integrated circuit
- planar integrated circuit
- planar-mounted integrated circuit
- plastic encapsulated integrated circuit
- plastic integrated circuit
- p-n junction isolated integrated circuit
- polymer thick-film circuit
- prediffused integrated circuit
- programmable integrated circuit
- proprietary integrated circuit
- quick Fourier transform circuit
- race-free circuit
- radiation-hardened integrated circuit
- RС circuit
- redundant integrated circuit
- refreshing circuit
- refresh circuit
- sample-hold circuit
- scaled integrated circuit
- scan design circuit
- schematic circuit
- Schottky TTL integrated circuit
- Schottky TTL circuit
- screen-printed integrated circuit
- sealed-junction integrated circuit
- self-aligned integrated circuit
- self-cased LSI circuit
- self-checking [self-testing] integrated circuit
- semiconductor circuit
- semicustom integrated circuit
- semicustomized integrated circuit
- S/H circuit
- single-chipcircuit
- singlecircuit
- skimming-and-reset circuit
- slice circuit
- small-integration circuit
- smart-power integrated circuit
- SOI integrated circuit
- solid-state integrated circuit
- solid integrated circuit
- SOS integrated circuit
- stacked circuit
- standard сеll-based semicustom integrated circuit
- Strassen algorithm LSI circuit
- stripline integrated circuit
- submicron integrated circuit
- subnanosecond integrated circuit
- superconducting integrated circuit
- superconductor integrated circuit
- surface-mounted integrated circuit
- test-manufactured integrated circuit
- thick-film hybrid integrated circuit
- thick-film integrated circuit
- thin-film hybrid integrated circuit
- thin-film integrated circuit
- three-diffusion integrated
- three-dimensional integrated circuit
- transistor circuit
- tri-mask integrated circuit
- UHSI circuit
- uncommitted integrated circuit
- unipolar integrated circuit
- user specified integrated circuit
- vacuum integrated circuit
- VHSI circuit
- VLSI circuit
- wafer-scale integrated circuit
- wired OR circuit
- 3D integrated circuit -
3 pad
контактний майданчик; стовпчиковий вивід, контактний стовпчик (див. т-ж bump)- bondingpad- bondpad
- chip-bonding chip-connection pad
- chip-connection pad
- conductive pad
- contact pad
- connection pad
- die pad
- electrode pad
- interconnect pad
- I/O pads
- lead-connection pad
- metallized pad
- mounting pad
- polishing pad
- probe contact pad
- support pad
- terminal pad
- test pad
- wiring pad
См. также в других словарях:
die bonding — lusto prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip bonding; die attachment; die bonding vok. Chipbonden, n rus. присоединение кристалла ИС, n pranc. brochage de puce, m; connexion de puce, f … Radioelektronikos terminų žodynas
Bonding (Psychotherapie) — Die Bonding Psychotherapie (früher: New Identity Process oder NIP) ist ein therapeutisches Konzept, das Dan Casriel, Psychiater und Analytiker, aufgrund eines Auftrags des Staates New York für die Arbeit mit schwer Drogenabhängigen in den 1960er… … Deutsch Wikipedia
Bonding-studenteninitiative — Offizielles Logo der bonding studenteninitiative e. V. Die bonding studenteninitiative e. V. (kurz bonding) ist eine unabhängige, unpolitische und gemeinnützige Studenteninitiative. Sie wurde 1988 in Aachen gegründet. Der Name leitet sich dabei… … Deutsch Wikipedia
Bonding-studenteninitiative e.V. — Offizielles Logo der bonding studenteninitiative e. V. Die bonding studenteninitiative e. V. (kurz bonding) ist eine unabhängige, unpolitische und gemeinnützige Studenteninitiative. Sie wurde 1988 in Aachen gegründet. Der Name leitet sich dabei… … Deutsch Wikipedia
die attachment — lusto prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip bonding; die attachment; die bonding vok. Chipbonden, n rus. присоединение кристалла ИС, n pranc. brochage de puce, m; connexion de puce, f … Radioelektronikos terminų žodynas
Bonding — I Bonding [dt. Bindung, Verbindung, »Fesselung«], Kommunikation: Kanalbündelung. II Bonding, Halbleitertechnologie: ältere Anschlusstechnik, die bei Chips zum Einsatz kommt. Dabei wird deren Kern (Die) durch Drähte mit d … Universal-Lexikon
die-and-wire bonding — lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f … Radioelektronikos terminų žodynas
chip bonding — lusto prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip bonding; die attachment; die bonding vok. Chipbonden, n rus. присоединение кристалла ИС, n pranc. brochage de puce, m; connexion de puce, f … Radioelektronikos terminų žodynas
Tape-Automated Bonding — Beschreibung Tape Automated Bonding (TAB) ist ein Kontaktierungsverfahren für rohe Halbleiter Chips (integrierter Schaltkreis) und ermöglicht die schnelle Montage meist direkt auf der Leiterplatte (Chip on Board). Als Träger dient ein … Deutsch Wikipedia
Wire bonding — Das Drahtbonden (von engl. bond Verbindung , Haftung ) bezeichnet in der Elektronik Fertigung einen Verfahrensschritt, bei dem mittels dünner Drähte (Bonddraht) ein Chip (engl. die, zum Beispiel ein integrierter Schaltkreis, eine Leuchtdiode, ein … Deutsch Wikipedia
bumped tape-automated chip bonding — automatinis lustų prijungimas prie juostinio tiekiklio gūburinių išvadų statusas T sritis radioelektronika atitikmenys: angl. bumped tape automated chip bonding vok. automatisches Bonden von Halbleiterchips an die Trägerstreifenbondhügel, n rus.… … Radioelektronikos terminų žodynas