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1 интеграция в масштабе целой пластины
1) Engineering: wafer scale integration2) Information technology: wafer-scale integrationУниверсальный русско-английский словарь > интеграция в масштабе целой пластины
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2 кристалл размером с пластину
Information technology: wafer-scale chip (не требующую скрайбирования), wafer-scale restructurable (не требующую скрайбирования)Универсальный русско-английский словарь > кристалл размером с пластину
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3 в масштабе (целой) пластины
Information technology: wafer-scale (об уровне интеграции)Универсальный русско-английский словарь > в масштабе (целой) пластины
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4 в масштабе целой пластины
Information technology: wafer-scale (об уровне интеграции)Универсальный русско-английский словарь > в масштабе целой пластины
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5 интеграция в масштабе (целой) пластины
Information technology: wafer-scale integrationУниверсальный русско-английский словарь > интеграция в масштабе (целой) пластины
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6 размещённый на (целой) пластине
Information technology: wafer-scaleУниверсальный русско-английский словарь > размещённый на (целой) пластине
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7 размещённый на целой пластине
Information technology: wafer-scaleУниверсальный русско-английский словарь > размещённый на целой пластине
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8 в масштабе пластины
Information technology: (целой) wafer-scale (об уровне интеграции)Универсальный русско-английский словарь > в масштабе пластины
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9 интеграция в масштабе пластины
Information technology: (целой) wafer-scale integrationУниверсальный русско-английский словарь > интеграция в масштабе пластины
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10 размещённый на пластине
Information technology: (целой) wafer-scaleУниверсальный русско-английский словарь > размещённый на пластине
См. также в других словарях:
Wafer fabrication — is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. Wafer… … Wikipedia
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Very-large-scale integration — VLSI redirects here. For the former company, see VLSI Technology. Very large scale integration (VLSI) is the process of creating integrated circuits by combining thousands of transistors into a single chip. VLSI began in the 1970s when complex… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Nasiri-Fabrication — Process The Nasiri Fabrication Process, patented by InvenSense, uses a wafer to wafer bonding process that allows for direct integration of the fabricated MEMS wafers to any off the shelf CMOS wafer at the wafer level. Although the wafer bonding… … Wikipedia
Microelectromechanical system oscillator — Microelectromechanical system (MEMS) oscillators are timing devices that generate highly stable reference frequencies. These reference frequencies are used to sequence electronic systems, manage data transfer, define radio frequencies, and… … Wikipedia
Ivor Catt — (born 1935) is a British electronics engineer known principally for his alternative theories of electromagnetism. He received a B.A. degree from Cambridge University, and has won two major product awards for his innovative computer chip designs.… … Wikipedia
Sinclair Research — Infobox Company name = Sinclair Research Ltd type = Limited company foundation = Cambridge, England (1961) location = London, England key people = Sir Clive Sinclair, Founder Nigel Searle, Director (1973 to 1986) Jim Westwood Rick Dickinson,… … Wikipedia
Zinc oxide — Other names Zinc white Calamine Identifiers … Wikipedia
Neuroprosthetics — (also called neural prosthetics) is a discipline related to neuroscience and biomedical engineering concerned with developing neural prostheses. Neural prostheses are a series of devices that can substitute a motor, sensory or cognitive modality… … Wikipedia
Monolayer doping — (MLD) is a well controlled, wafer scale surface doping technique first developed at the University of California, Berkeley, in 2007.[1] This work is aimed for attaining controlled doping of semiconductor materials with atomic accuracy, especially … Wikipedia