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1 кристалл СБИС
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2 СБИС-кристалл
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3 кристалл СБИС
nmicroel. VLSI-Chip -
4 device scale
<edp.ic> (number of devices per chip; e.g. SSI, MSI, LSI, VLSI) ■ Integrationsgrad m ; Integrationsdichte f ; Packungsdichte f -
5 level of integration
<edp.ic> (number of devices per chip; e.g. SSI, MSI, LSI, VLSI) ■ Integrationsgrad m ; Integrationsdichte f ; Packungsdichte f -
6 package density
<edp.ic> (number of devices per chip; e.g. SSI, MSI, LSI, VLSI) ■ Integrationsgrad m ; Integrationsdichte f ; Packungsdichte f<el.ic> ■ Packungsdichte f -
7 packaging density
<edp.ic> (number of devices per chip; e.g. SSI, MSI, LSI, VLSI) ■ Integrationsgrad m ; Integrationsdichte f ; Packungsdichte f<el.ic> ■ Packungsdichte f< join> ■ Packungsdichte f -
8 scale of integration
<edp.ic> (number of devices per chip; e.g. SSI, MSI, LSI, VLSI) ■ Integrationsgrad m ; Integrationsdichte f ; Packungsdichte f
См. также в других словарях:
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Clipper chip — Not to be confused with Clipper architecture. The Clipper chip was a chipset that was developed and promoted by the U.S. Government[1] as an encryption device to be adopted by telecommunications companies for voice transmission. It was announced… … Wikipedia