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1 device
1) прилад (напр. ІС, транзистор, діод); компонент; елемент 2) пристрій - active device
- add-on device
- analog device
- array device
- attached device
- backup device
- beam-leadeddevice
- beam-leaddevice
- bipolar device
- bipolar-MOS device
- blown-fuse device
- bubble-domain device
- bubble- device
- bucket-brigade device
- bulk асoustic-wave device
- bulk-channel carrier-transfer device
- bulk-effect device
- carrier-transfer device
- charge-coupled device
- charge-domain device
- charge-injection device
- charge-priming device
- charge-transfer device
- chip-and-wire device
- CMOS device
- CMOS/SOS device
- compound-semiconductor device
- contiguous-disk device
- controlled surface device
- custom-designed device
- custom device
- dense device
- depletion-modedevice
- depletiondevice
- dielectric isolation device
- diffused device
- discrete device
- double-diffused MOS device
- elastic-surface-wave device
- electrooptic device
- elementary device
- enchancement-mode device
- enchancement device
- end-use device
- epiplanar device
- epitaxial device
- FAMOS device
- field-effect device
- field-programmable device
- FIMOS device
- functional device
- graded-gap semiconductor device
- graded-gap device
- Gurm-effect device
- Gurm device
- Hall-effectdevice
- Halldevice
- hardeneddevice
- harddevice
- heteroepitaxial device
- heterojunction device
- high-gain device
- high-immunity noise device
- high-technology device
- high-threshold device
- homojunction device
- hybrid high-power device
- identification device
- I2L device
- image [imaging] device
- IMPATT device
- implanted device
- integrated-optic device
- integrated semiconductor device
- integration device
- interdigitated device
- interface device
- Josephson-junctiondevice
- Josephsondevice
- Josephson logic device
- junction-isolated device
- large-scale integrated device
- large-scale integration device
- latch-up free CMOS device
- leaded device
- leadless inverted device
- light-wave device
- locked-in device
- logic array device
- low-power Schottky device
- magnetostatic-wave device
- majority-carrier device
- mask-programmable device
- metal-masked device
- metal-semiconductor device
- microdiscrete device
- microelectronic device
- minority-carrier device
- MIS-type device
- MIS device
- mixed-process device
- mixed device
- molecular-beam epitaxy-based device
- monolithic device
- MOS device
- MTL device
- multilayered device
- multilevel device
- n-channel MOS device
- n-channel device
- negative-resistance device
- non-CPU device
- n–p–n device
- off-chip device
- on-chip device
- optocoupler semiconductor device
- optocoupling device
- passive device
- p-channel MOS device
- p-channel device
- peripheral device
- permalloy bubble device
- permalloy T-bar device
- photo-coupled semiconductor device
- photosensitive device
- piezoelectric device
- piggyback device
- planar device
- plotting device
- plug-in device
- p-n-p device
- positioning device
- printing device
- programmable logic-array device
- programmable device
- quantum device
- quantum-well device
- redundancy device
- resin-molded device
- SAW device
- SAW delay device
- scaled-downdevice
- scaleddevice
- Schottky-barrier device
- Schottky device
- second-source device
- self-aligned semiconductor device
- semiconductor-on-sapphire
- silicon-on-dielectric device
- silicon-on-insulator device
- silicon-on-sapphire device
- single device
- single-crystal device
- slow device
- SLS device
- small-geometry device
- solder-evacuator device
- SOS/MOS device
- stacked semiconductor device
- static-sensitive device
- stripeline device
- submicron-scale MOS device
- superconducting Josephson-junction device
- superconducting quantum interference device
- superconductive quantum interferometric device
- super-lattice functional device
- superstructure device
- surface-acoustic-wave device
- surface charge-transfer device
- surface-mounted device
- switching device
- TAB device
- thermocompression bonded device
- thick-film device
- thin-film device
- transcalent device
- transferred-electron device
- transil-time-negative-resistance device
- trench isolated device
- tunnel -еffect device
- tunnel device
- two-level polysilicon MOS device
- ULA device
- ultrafine-scale device
- ultra-large-scale integrated device
- ultra-submicron device
- uncased device
- vertical-junction device
- very large-scale integrated-circuit device
- very large-scale integration device
- V-groove MOS device
- V-groove device
- wafer-printing device -
2 impurity
1) (легуюча) домішка 2) забруднення, небажана домішка - atomic impurity
- background impurity
- base impurity
- channel-stop impurity
- compensated impurity
- compensating impurity
- conductivity -type- determining impurity
- conductivity determining impurity
- contaminating impurity
- deep-level impurity
- deep-lying impurity
- diffusant impurity
- diffusing impurity
- donor impurity
- dopant impurity
- doping impurity
- emitter impurity
- free carrier impurity
- group V impurity
- implanted impurity
- interstitial impurity
- ion implanted impurity
- lifetime killing impurity
- lifetime shortening impurity
- migrating impurity
- molecular impurity
- n-type impurity
- polarized impurity
- p-type impurity
- shallow-level impurity
- shallow-lying impurity
- spin-on impurity
- stoichiometric impurity
- substitutional impurity
- transition metal impurity
- trap impurity
- ultratrace impurity -
3 diode
діод - avalanche diode
- avalanche-injection diode
- avalanche-transit-time diode
- back-biased diode
- BARITT barrier-injection and transit-time diode
- BARITT diode
- barrier-injection and transit-time diode
- base-emitter diode
- buried Zener diode
- CATT diode
- charge-storage diode
- chip diode
- clamping diode
- clamp diode
- collector-base diode
- controlled avalanche-transit-time diode
- deep diode
- double-diffused diode
- emitter-base diode
- emitting diode
- Esaki diode
- gold-barrier Schottky diode
- graded-junction diode
- Gunn-еffectdiode
- Gunndiode
- heterojunction diode
- hot-carrier diode
- impact-avalanche and transit-time IMPATT diode
- impact-avalanche and transit-time diode
- intrinsic-barrier diode
- isolation diode
- laser diode
- light-emitting diode
- MBE diode
- mercury-probe-silicon diode
- mesa-type diode
- mesa diode
- negative-resistance diode
- negative diode
- organic-on-GaAs diode
- pin diode
- planar epitaxial diode
- punch-through diode
- Read diode
- reference diode
- reverse-biased diode
- Schottky-barrierdiode
- Schottkydiode
- shallow diode
- source-drain diode
- temperature-compensated diode
- TRAPATT trapped plasma avalanche transit-time diode
- TRAPATT diode
- trapped plasma avalanche transit-time diode
- variable-capacitance diode
- variable-reactance diode
- VC diode
- voltage-reference diode
- voltage-regulator diode
- Zener diode -
4 material
матеріал - acceptor material
- adulterated semiconductor material
- base material
- binding material
- brittle material
- bubble material
- carrier material
- cermet material
- coarse-featured resist material
- composite material
- compound semiconductor material
- conductivity-type imparting material
- contact material
- contrast enhancing material
- dopant masking material
- doped material
- doping material
- electronic material
- electron resist material
- encapsulating material
- encapsulation material
- epitaxial material
- etchant masking material
- etching material
- evaporated material
- evaporation material
- filler material
- film material
- fine-featured resist material
- foreign material
- fragile material
- group III-V compound semiconductor material
- heavily doped material
- high-resistivity material
- host material
- impurity material
- laminated material
- liquid-crystal material
- lowly doped material
- low-resistivity material
- LSCO material
- magnetostrictive material
- mask-forming material
- mask material
- mismatched materials
- molding material
- multilayer material
- negative-image material
- organosilicone material
- packaging material
- parent material
- patterned material
- photoresist material
- photoresponsive material
- photosensitive material
- piezoelectric material
- plastic material
- polycrystalline material
- positive-image material
- refractory material
- resist material
- resistive material
- semiconductive material
- semiconductor material
- semiconductor-glass composite material
- silicon-on-insulator material
- silicon-on-sapphire material
- Si-MBE material
- single-crystal material
- spinel material
- starting material
- stop-etch material
- substrate material
- superconducting material
- support material
- thallium-based material
- thixotropic material
- virgin material
- Y–Ba–Cu–O material
- Y1–Ba2–Cu3–O7-x material
- 1-2-3 material -
5 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
См. также в других словарях:
Type carrier — Шрифтоноситель … Краткий толковый словарь по полиграфии
Type carrier cam — Кулачок шрифтоносителя … Краткий толковый словарь по полиграфии
Type carrier connecting rod — Тяга механизма шрифтопереносителя … Краткий толковый словарь по полиграфии
Carrier Strike Group Eleven — crest Active 1 October 2004 to date.[1] … Wikipedia
Carrier Air Wing Eight — Infobox Military Unit unit name= Carrier Air Wing Eight caption= CVW 8 Insignia dates= 1 June 1943 Present country= United States allegiance= branch= US Navy type= Carrier Air Wing role= size= command structure= United States Fleet Forces Command … Wikipedia
Carrier Air Wing Six — Infobox Military Unit unit name= Carrier Air Wing Six caption= CVW 6 Insignia dates= 1 July 1938 – 1 April 1993 country= United States allegiance= branch= US Navy type= Carrier Air Wing role= size= command structure= garrison= garrison label=… … Wikipedia
Carrier Air Wing Five — Infobox Military Unit unit name= Carrier Air Wing Five caption= CVW 5 Insignia dates= 15 February 1943 Present country= United States allegiance= branch= US Navy type= Carrier Air Wing role= size= command structure= United States Pacific Fleet… … Wikipedia
Carrier Air Wing Eleven — Infobox Military Unit unit name= Carrier Air Wing Eleven caption= CVW 11 Insignia dates= 27 October 1942 Present country= United States allegiance= United States of America branch= United States Navy type= Carrier Air Wing role= size= command… … Wikipedia
Carrier Air Wing Two — Infobox Military Unit unit name= Carrier Air Wing Two caption= CVW 2 Insignia dates= May 1, 1945 Present country= United States allegiance= branch= US Navy type= Carrier Air Wing role= size= command structure= garrison= Naval Air Station Lemoore… … Wikipedia
Carrier Air Wing Seven — Infobox Military Unit unit name= Carrier Air Wing Seven caption= CVW 7 Insignia dates= 20 July 1943 Present country= United States allegiance= branch= US Navy type= Carrier Air Wing role= size= command structure= United States Fleet Forces… … Wikipedia
Carrier Air Wing Fourteen — Infobox Military Unit unit name= Carrier Air Wing Fourteen caption= CVW 14 Insignia dates= July 1950 Present country= United States allegiance= branch= US Navy type= Carrier Air Wing role= size= command structure= United States Pacific Fleet… … Wikipedia