-
1 pad
контактний майданчик; стовпчиковий вивід, контактний стовпчик (див. т-ж bump)- bondingpad- bondpad
- chip-bonding chip-connection pad
- chip-connection pad
- conductive pad
- contact pad
- connection pad
- die pad
- electrode pad
- interconnect pad
- I/O pads
- lead-connection pad
- metallized pad
- mounting pad
- polishing pad
- probe contact pad
- support pad
- terminal pad
- test pad
- wiring pad -
2 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
-
3 point
точка - connection point
- control point
- Curie point
- current асcumulation point
- dew point
- flash point
- input intercept point IIP
- input intercept point
- output intercept point OIP
- output intercept point
- projecting point
- reference point
- saturation point
- single defect point
- test points
- transformation point
- transition point
- wiring point
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