substrate+package

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• Substrate mapping — Substrate mapping, also known as wafer mapping is a process in which the performance of semiconductor devices on a substrate is represented by a map showing the performance as a colour coded grid. The map is a convenient representation of the… …   Wikipedia

• Substrate coupling — In an integrated circuit, a signal can couple from one node to another via the substrate. This phenomenon is referred to as substrate coupling or substrate noise coupling.The push for reduced cost, more compact circuit boards, and added customer… …   Wikipedia

• electronic substrate and package ceramics — Introduction       advanced industrial materials that, owing to their insulating qualities, are useful in the production of electronic components.       Modern electronics are based on the integrated circuit, an assembly of millions of… …   Universalium

• Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… …   Wikipedia

• System in package — A System in a Package or System in Package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically… …   Wikipedia

• Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

• Multi Chip Package — Ein klassisches Multi Chip Modul (MCM, manchmal auch MCP – Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dies), die in einem gemeinsamen Gehäuse untergebracht sind und nach außen wie ein Chip aussehen, so funktionieren und… …   Deutsch Wikipedia

• Activated sludge — is a process dealing with the treatment of sewage and industrial wastewaters.cite book | author=Beychok, Milton R. | title=Aqueous Wastes from Petroleum and Petrochemical Plants| edition=1st Edition | publisher=John Wiley Sons Ltd | year=1967 |… …   Wikipedia

• Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

• Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

• Light-emitting diode — LED redirects here. For other uses, see LED (disambiguation). Light emitting diode Red, pure green and blue LEDs of the 5mm diffused type Type Passive, optoelectronic Working principle Electr …   Wikipedia