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1 processing
1) (технологічна) обробка; проведення процесу 2) технологія (див. т-ж process, technique, technology) 3) обробка (інформації) - array processing
- batch-modeprocessing
- batchprocessing
- beam processing
- bipolar processing
- chip processing
- CMOS/SOS processing
- component pre-insertion processing
- component processing
- computer word processing
- digital image processing
- dry processing
- electroless processing
- electron-beam processing
- epitaxial processing
- excimer laser processing
- exposive-shock processing
- fabrication processing
- hands-off processing
- high-resolution processing
- high-temperature processing
- high-volume processing
- high-yield processing
- image processing
- in-line processing
- ion-beam processing
- ion-implantation processing
- isothermal processing
- laser cold processing
- liquid chemical processing
- liquid processing
- lithographic processing
- maskless processing
- microelectronic processing
- microgravity processing
- MOS processing
- multimask processing
- multi-User MEMS processing MUMPS
- multi-User MEMS processing
- multiple-chemical processing
- on-line data processing
- pel-to-pel processing
- photochemical processing
- photoresist processing
- pipeline processing
- planar processing
- planar plasma processing
- plasma processing
- post ion-implantation processing
- pyrolytic laser processing
- radiation-free processing
- relief-mask processing
- single-wafer semiconductor processing
- single-wafer processing
- slice-at-a-time processing
- space semiconductor processing
- submicrometer processing
- submicron processing ї
- TAB processing
- temperature-gradient zone-melting processing
- thermal processing
- unattended processing
- vacuum infrared processing
- vertical processing
- wafer-by-wafer processing
- wet chemical processing
- wet processingEnglish-Ukrainian dictionary of microelectronics > processing
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2 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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3 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
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4 package
(pkg.; Pkg.; pckge)n марк. 1. пакунок; пачка; пакет; a пакетний; 2. комплекс; комплект; пакет; 3. «пакет», комплекс угод; a комплексний; пакетний1. предмети, які упаковані та складені разом; 2. сукупність товарів, предметів, понять чи ідей, що становить одне ціле і пропонується або продається як одне ціле; 3. комплекс угод за кількома питаннями, укладених на основі взаємних поступок; комплексна угода═════════■═════════application package пакет прикладних програм; budget package пакет бюджетних пропозицій; compensation package пакет відшкодовування; damaged package пошкоджений пакунок; decision package пакет рішень; economic package комплекс заходів у галузі економіки; economic policy package комплекс заходів у галузі економічної політики; graphics package пакет програм для графіки; pay package угода про надбавки до заробітної плати • контракт, що складається з кількох компонентів; program package пакет програм; salary package угода про платню; shipping package комплексна вантажно-транспортна угода; software package пакет засобів програмування; tax package пакет податкових заходів; taxation package комплекс заходів оподаткування • комплекс заходів у галузі податкової політики; technology package пакет технологічних послуг; trial-size package пробний розмір пакета; wage package комплексна угода про заробітну плату; word processing package пакет програм для опрацювання текстів═════════□═════════package deal комплексна угода; package quantity пакетна кількість; package size пакетний розмір; to offer a package of services пропонувати/запропонувати пакет послуг; to offer as a package пропонувати/запропонувати як комплекс; to provide a package of services дати/ подати пакет послуг; to provide as a — подавати/подати як комплекс; to put together as a package складати/скласти як комплекс; to sell as a package продавати/продати як комплекс; to win a package добиватися/добитися комплексу заходів═════════◇═════════комплекс < зах. єв. мов: нім. Kompléx, фр. complexe, англ. complex — сукупність об'єктів, що становлять єдине ціле < лат. complexus — поєднання; охоплення; зв'язок (ЕСУМ 2: 542; СІС: 345); пакет < нім. Paket, фр. paquet — згорток якихось речей (СІС: 492)
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