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1 lithography
(мікро) літографія. Процес перенесення малюнка на поверхню пластини за допомогою світлового випромінювання (photolithography), потоку електронів або рентгенівського випромінювання (X-ray lithography) - charged-particle lithography
- contact lithography
- contactless lithography
- contrast-enhanced lithography
- deep-UV lithography
- direct growth lithography
- direct-write electron-beam lithography
- dot lithography
- dual-surface lithography
- electron-beam lithography
- electron lithography
- excimer laser lithography
- fine-line lithography
- focused ion-beam lithography
- full-wafer lithography
- bard-contact lithography
- high-resolution lithography
- high-voltage EB lithography
- holographic lithography
- hybrid lithography
- i-line lithography
- ion-beam lithography
- laser-basedlithography
- laserlithography
- lift-off lithography
- mask lithography
- maskless lithography
- micrometer micron lithography
- micron lithography
- molecular-level lithography
- optical lithography
- positive-resist projection lithography
- precise registration lithography
- projection lithography
- proximity lithography
- raster-scan electron-beam lithography
- resistless lithography
- scaled-down lithography
- scanning electron-beam lithography
- scanning ion-beam lithography
- self-aligned dual-surface lithography
- soft lithography
- soft-contact lithography
- step-and-repeat lithography
- step-on-wafer lithography
- stepper lithography
- submicron lithography
- synchrotron-radiationlithography
- synchrotronlithography
- ultraviolet lithography
- vector-scan electron-beam lithography
- wafer lithography
- wafer-stepper lithography
- write e-beam lithography
- X-ray lithographyEnglish-Ukrainian dictionary of microelectronics > lithography
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2 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
3 resist
резист; фоторезист - Azoplate photo resist
- Azoplate resist
- carbonaceous resist
- deep-UV resist
- dopant resist
- dry-developed resist
- dry-film resist
- electron-beam resist
- electron-sensitive resist
- halide resist
- high-speed resist
- imaged resist
- large molecular weight resist
- metal etch resist
- multilayer resist
- multilevel resist
- near-UV resist
- negative-type resist
- negative resist
- non-liquid resist
- novolak-based resist
- optical resist
- photo resist
- photopolymer resist
- polysiloxane resist
- positive-type resist
- positive resist
- printed-circuit resist
- radiation-sensitive resist
- screenable resist
- self-developing resist
- slow resist
- ultraviolet-sensitive resist
- ultraviolet resist
- X-ray resist -
4 emulsion
емульсія; фотоемульсія, фоторезист - fine-line emulsion
- high-resolution emulsion
- light-sensitive emulsion
- negative emulsion
- positive emulsion
- UV emulsion -
5 FET
польовий транзистор, ПТ - bipolar inversion channel FET
- Bloch FET
- buried-channel FET
- charge-coupled FET
- closed-geometry FET
- compound FET
- conductor-insulator-semiconductor FET
- depletion-mode FET
- depletion FET
- dual-gate FET
- enhancement-modeFET
- enhancementFET
- floating-gate FET
- heterointerface FET
- heterostructure insulated-gate FET
- high-реrformance FET
- infrared FET
- insulated-gate FET
- ion-implanted FET
- ion-sensitive FET
- junction-gateFET
- junctionFET
- K-band FET
- lateral FET
- MBE FET
- metal-gate FET
- metal-insulator-semiconductor FET
- metal-охide-semiconductor
- metal-Schottky FET
- metal-semiconductor FET
- microwave FET
- modulation-doped FET
- multichannel FET
- multiple-gate finger FET
- nanometer-scale FET
- n-channel FET
- negative FET
- negative resistance FET
- normally-off FET
- normally-on FET
- offset-gate FET
- p-channel FET
- photosensitive FET
- photo FET
- p–n-junction FET
- positive-type FET
- resonant tunneling FET
- Schottky-diode FET
- Schottky-gate FET
- self-aligned gate FET
- self-aligned FET
- short-channel FET
- short gate-length FET
- silicon-gate FET
- tunneling-transfer FET
- two-dimensional electron-gas FET
- unipolar FET
- vertical-channel [vertical-structure] FET
- V-gate FET
- δ-doped FET
- δ FET -
6 material
матеріал - acceptor material
- adulterated semiconductor material
- base material
- binding material
- brittle material
- bubble material
- carrier material
- cermet material
- coarse-featured resist material
- composite material
- compound semiconductor material
- conductivity-type imparting material
- contact material
- contrast enhancing material
- dopant masking material
- doped material
- doping material
- electronic material
- electron resist material
- encapsulating material
- encapsulation material
- epitaxial material
- etchant masking material
- etching material
- evaporated material
- evaporation material
- filler material
- film material
- fine-featured resist material
- foreign material
- fragile material
- group III-V compound semiconductor material
- heavily doped material
- high-resistivity material
- host material
- impurity material
- laminated material
- liquid-crystal material
- lowly doped material
- low-resistivity material
- LSCO material
- magnetostrictive material
- mask-forming material
- mask material
- mismatched materials
- molding material
- multilayer material
- negative-image material
- organosilicone material
- packaging material
- parent material
- patterned material
- photoresist material
- photoresponsive material
- photosensitive material
- piezoelectric material
- plastic material
- polycrystalline material
- positive-image material
- refractory material
- resist material
- resistive material
- semiconductive material
- semiconductor material
- semiconductor-glass composite material
- silicon-on-insulator material
- silicon-on-sapphire material
- Si-MBE material
- single-crystal material
- spinel material
- starting material
- stop-etch material
- substrate material
- superconducting material
- support material
- thallium-based material
- thixotropic material
- virgin material
- Y–Ba–Cu–O material
- Y1–Ba2–Cu3–O7-x material
- 1-2-3 material -
7 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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