-
1 tin-lead solder
English-Ukrainian analytical chemistry dictionary > tin-lead solder
-
2 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
3 glass
1) скло 2) аморфна форма діоксиду кремнію - aluminosilicate glass
- barium glass
- boron glass
- borosilicate glass
- chalcogenide glass
- compound glass
- conductive glass
- fiber glass
- hard glass
- lead glass
- lime glass
- liquid glass
- multicomponent glass
- phosphor-silicate glass
- quartz glass
- resin glass
- sealingglass
- sealglass
- silicate glass
- silicious glass
- soda glass
- solder glass
- spin-on glass -
4 attachment
1) (при) єднання; (при) кріплення 2) пристосування; приналежність - epoxy die attachment
- eutectic die attachment
- flip-chip attachment
- flywire attachment
- lead-frame attachment
- reflow attachment
- solder die attachmentEnglish-Ukrainian dictionary of microelectronics > attachment
См. также в других словарях:
lead solder — švino lydmetalis statusas T sritis chemija apibrėžtis 18–97% Pb lydinys su kitais metalais (ppr. Sn, Cd, Bi, Ag, In, Zn). atitikmenys: angl. lead solder rus. свинцовый припой … Chemijos terminų aiškinamasis žodynas
Lead poisoning — Classification and external resources An X ray demonstrating the characteristic finding of lead poisoning, dense metaphyseal lines. ICD 10 T … Wikipedia
Solder paste — (or solder cream) is used for connecting the terminations of the IC packages with that of land patterns on the PCB. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are… … Wikipedia
lead hazard — A health hazard resulting from the breakdown of lead paint or lead solder, and the creation of lead dust or lead in drinking water. When such lead is ingested, it can cause brain damage and other damage. A 1996 federal law, Title X, and the… … Law dictionary
Solder — A solder is a fusible metal alloy with a melting point or melting range of 90 to 450 °C (200 to 840 °F), used in a process called soldering where it is melted to join metallic surfaces. It is especially useful in electronics and plumbing. Alloys… … Wikipedia
solder bump lead — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
solder bump pad — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
Lead — (pronEng|ˈlɛd) is a main group element with a symbol Pb ( la. plumbum). Lead has the atomic number 82. Lead is a soft, malleable poor metal, also considered to be one of the heavy metals. Lead has a bluish white color when freshly cut, but… … Wikipedia
Solder — Sol der, n. [Formerly soder; F. soudure, OF. soudeure, fr. OF. & F. souder to solder, L. solidare to fasten, to make solid. See {Solid}, and cf. {Sawder}.] A metal or metallic alloy used when melted for uniting adjacent metallic edges or… … The Collaborative International Dictionary of English
solder — [säd′ər] n. [ME soudre < OFr souldure < soulder, to make solid < L solidare < solidus, SOLID] 1. a metal alloy that is heated and used to join or patch metal parts or surfaces: soft solders of tin lead alloys melt easily; hard (or… … English World dictionary
Lead — (l[e^]d), n. [OE. led, leed, lead, AS. le[ a]d; akin to D. lood, MHG. l[=o]t, G. loth plummet, sounding lead, small weight, Sw. & Dan. lod. [root]123.] 1. (Chem.) One of the elements, a heavy, pliable, inelastic metal, having a bright, bluish… … The Collaborative International Dictionary of English