-
1 interconnection substrate
підкладка з шаром міжз’єднаньEnglish-Ukrainian dictionary of microelectronics > interconnection substrate
-
2 substrate
підкладка; основа - amorphous insulating substrate
- blank substrate
- bulk substrate
- composite substrate
- compound semiconductor substrate
- dislocation-free substrate
- foreign substrate
- garnet substrate
- glass-сеramic substrate
- glazed substrate
- high-resistivity substrate
- implanted substrate
- insulative substrate
- interconnection substrate
- ion-milled substrate
- low-resistivity substrate
- mask substrate
- MP substrate
- multilayer substrate
- multilayer printed substrate
- n-typesubstrate
- nsubstrate
- passive substrate
- porcelainized steel substrate
- porous polishing substrate
- preloaded substrate
- prescreened substrate
- pretinned substrate
- printed-wiring substrate
- p-type substrate
- silicon through-hole substrate
- SOI substrate
- SOS substrate
- stepless substrate
- thick-film multilevel substrate
- thick-film screened substrate
- thin-film substrate
- V-grooved silicon substrate
- V-grooved substrate
- wiring substrateEnglish-Ukrainian dictionary of microelectronics > substrate
-
3 layer
1. ім. шар; плівка 2. дієсл. наносити шар - accumulation layer
- amorphized layer
- anti-oxidation layer
- barrier layer
- base layer
- blanket layer
- blocking layer
- boundary layer
- branch layer
- buffer layer
- buried layer
- cap layer
- composite layer
- conducting layer
- conductor layer
- contact layer
- continuous layer
- depletion layer
- deposited layer
- diffused [diffusion] layer
- diffusion-impervious layer
- diffusion-source layer
- doped layer
- driving layer
- epitaxial layer
- epi layer
- etch-resistant layer
- evaporated layer
- evaporation layer
- field oxide layer
- Gaussian-doped layer
- heteroepitaxial layer
- high-concentration layer
- high-mobility layer
- homoepitaxial layer
- host layer
- implantation layer
- implanted layer
- impurity layer
- inert layer
- injection layer
- injector layer
- inset oxide layer
- insulating layer
- insulation layer
- insulator layer
- interconnection layer
- interface layer
- interfacial layer
- interlayer dielectric film layer
- intrinsic layer
- inversion layer
- ion-implantation layer
- lacquer layer
- lightly doped layer
- liquid-phase epitaxial layer
- low-mobility layer
- masking layer
- metallizationlayer
- metallayer
- metallized layer
- molecular epitaxy layer
- monoatomic layer
- monomolecular layer
- multiple layer
- multiple wiring layers
- n layer
- native layer
- nucleating layer
- ohmic layer
- organic passivation layer
- oxide-inhibiting layer
- p layer
- passivating layer
- passivation layer
- photosensitive layer
- planarizing layer
- polysilicon layer
- protective layer
- pyrolytically deposited layer
- registered layers
- resistive layer
- sacrificial layer
- sandwiched layers
- sealing layer
- seal layer
- separation layer
- signal layer
- source layer
- space-charge layer
- stepped layers
- stopping layer
- substrate layer
- superconductive layer
- superimposed layers
- superlattice layer
- supported semiconductor layer
- thermal-охide layer
- transition layer
- vacuum-deposited layer
- vacuum-evaporated layer
- via layer
- wiring layer
- wiring channel layer
- δ-doping layer -
4 line
1) лінія 2) струмопровідна доріжка; з’єднання; шина; дріт 3) (потокова) технологічна лінія 4) серія(напр. ІС)
- acoustic delay line
- address line
- assembly line
- bake-etch-strip line
- batch-fabrication line
- batch-processing line
- bit line
- charge-coupled device delay line
- cleavage line
- conductingline
- conductor line
- coplanar line
- data line
- detail line
- diffused line
- digital delay line
- direct-written line
- dislocation line
- dispersive delay line
- doped line
- ECL line
- electroacoustic delay line
- fine line
- gate line
- Hamilton line
- interconnection line
- interconnect line
- laser-written metal line
- load line
- magnetic delay line
- magnetoacoustic delay line
- magnetostrictive delay line
- metal line
- microstrip line
- normal line
- one-track line
- production line
- quartz delay line
- score line
- scribed line
- select line
- sense line
- signal line
- slot line
- sonic delay line
- supply line
- surface-acoustic-wave delay line
- suspended-substrate line
- tapped delay line
- two-track line
- ultrasonic delay line
- wiring line -
5 structure
1. ім. структура; конструкція 2. дієсл. формувати структуру - array structure
- band structure
- basic structure
- bilevel structure
- bipolar structure
- bridge structure
- charge-coupled device structure
- charge-coupled structure
- charge-transfer device structure
- charge-transfer structure
- chip structure
- CMOS structure
- contiguous-disk propagating structure
- data structure
- delta-type doping structure
- disordered structure
- double-barrier parabolic well structure
- double-implanted structure
- functional structure
- gate structure
- graded structure
- heterogeneous structure
- heterojunction structure
- homogeneous structure
- implanted structure
- insulated substrate structure
- integrated circuit structure
- integrated structure
- interconnection structure
- interdigital collector structure
- interface structure
- isolation-moat structure
- Josephson-effect structure
- junction-isolated structure
- latchup resistant structure
- lateral structure
- lateral transistor structure
- lattice structure
- lattice-strained structure
- lead structure
- logic structure
- MAS structure
- mask structure
- merged structure
- mesa -type structure
- mesa structure
- MIM structure
- MIS structure
- MNOS structure
- monolithic-typestructure
- monolithicstructure
- MOS structure
- MSM structure
- MTOS structure
- multigate structure
- multilayer structure
- multilevel structure
- nonhomogeneous-base structure
- n-p-n structure
- nonresonant surface реriodical structure
- oxide-isolated structure
- pin structure
- planar structure
- planar superlattice structure
- p-n-p structure
- polycrystalline resistor structure
- propagating structure
- quantum-box structure
- quantum well structure
- quasi-one dimensional structure
- recessed structure
- regular crystal structure
- self-aligned gate structure
- self-registered gate structure
- semiconductor structure
- semi-ROX structure
- series-gated structure
- shallow chip structure
- shield structure
- short-channel device structure
- short-channel structure
- SIC structure
- silicide-on-polysilicon structure
- silicon-in-sapphire structure
- silicon-on- insulator structure
- silicon- insulator structure
- silicon-on-sapphire structure
- silicon-on-spinel structure
- silicon-over oxide-semiconductor structure
- single-crystal structure
- slow-wave structure
- sphalerite-type structure
- submicrometer structure
- superlattice structure
- surface periodical structure
- test structure
- tiered structure
- totally ordered structure
- trench structure
- trench-gate structure
- trench isolation structure
- triple-diffusion structure
- triple-poly structure
- twin-well structure
- ultra-small structure
- unipolar structure
- van der Pauw structure
- vertical injector structure
- vertically integrated structure
- V-groove structure
- wafer асceptance test structure
- wiring layer structure
- zinc blende structureEnglish-Ukrainian dictionary of microelectronics > structure
-
6 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
См. также в других словарях:
interconnection substrate — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
wiring substrate — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
Power electronic substrate — The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics,… … Wikipedia
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Multi-Chip Module — A Multi Chip Module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. The MCM itself will often be… … Wikipedia
Substrat mit Verbindungsschicht — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
Verdrahtungssubstrat — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
padėklas su vidiniais sujungimais — statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc. substrat à couche d interconnexions … Radioelektronikos terminų žodynas
substrat à couche d'interconnexions — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
substrat à interconnexions — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
подложка со слоем межсоединений — padėklas su vidiniais sujungimais statusas T sritis radioelektronika atitikmenys: angl. interconnection substrate; wiring substrate vok. Substrat mit Verbindungsschicht, n; Verdrahtungssubstrat, n rus. подложка со слоем межсоединений, f pranc.… … Radioelektronikos terminų žodynas
