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1 double-layer
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2 double-layer
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3 double-layer current
ток вершины (пика) -
4 double-layer metal personalization
спеціалізація ІС з використанням двошарової металізаціїEnglish-Ukrainian dictionary of microelectronics > double-layer metal personalization
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5 double-layer polysilicon gate (MOS) process
технологія МОН ІС з дворівневими полікремнієвими затворамиEnglish-Ukrainian dictionary of microelectronics > double-layer polysilicon gate (MOS) process
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6 double-layer polysilicon gate (MOS) process
технологія МОН ІС з дворівневими полікремнієвими затворамиEnglish-Ukrainian dictionary of microelectronics > double-layer polysilicon gate (MOS) process
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7 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
8 personalization
English-Ukrainian dictionary of microelectronics > personalization
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9 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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10 structure
1. ім. структура; конструкція 2. дієсл. формувати структуру - array structure
- band structure
- basic structure
- bilevel structure
- bipolar structure
- bridge structure
- charge-coupled device structure
- charge-coupled structure
- charge-transfer device structure
- charge-transfer structure
- chip structure
- CMOS structure
- contiguous-disk propagating structure
- data structure
- delta-type doping structure
- disordered structure
- double-barrier parabolic well structure
- double-implanted structure
- functional structure
- gate structure
- graded structure
- heterogeneous structure
- heterojunction structure
- homogeneous structure
- implanted structure
- insulated substrate structure
- integrated circuit structure
- integrated structure
- interconnection structure
- interdigital collector structure
- interface structure
- isolation-moat structure
- Josephson-effect structure
- junction-isolated structure
- latchup resistant structure
- lateral structure
- lateral transistor structure
- lattice structure
- lattice-strained structure
- lead structure
- logic structure
- MAS structure
- mask structure
- merged structure
- mesa -type structure
- mesa structure
- MIM structure
- MIS structure
- MNOS structure
- monolithic-typestructure
- monolithicstructure
- MOS structure
- MSM structure
- MTOS structure
- multigate structure
- multilayer structure
- multilevel structure
- nonhomogeneous-base structure
- n-p-n structure
- nonresonant surface реriodical structure
- oxide-isolated structure
- pin structure
- planar structure
- planar superlattice structure
- p-n-p structure
- polycrystalline resistor structure
- propagating structure
- quantum-box structure
- quantum well structure
- quasi-one dimensional structure
- recessed structure
- regular crystal structure
- self-aligned gate structure
- self-registered gate structure
- semiconductor structure
- semi-ROX structure
- series-gated structure
- shallow chip structure
- shield structure
- short-channel device structure
- short-channel structure
- SIC structure
- silicide-on-polysilicon structure
- silicon-in-sapphire structure
- silicon-on- insulator structure
- silicon- insulator structure
- silicon-on-sapphire structure
- silicon-on-spinel structure
- silicon-over oxide-semiconductor structure
- single-crystal structure
- slow-wave structure
- sphalerite-type structure
- submicrometer structure
- superlattice structure
- surface periodical structure
- test structure
- tiered structure
- totally ordered structure
- trench structure
- trench-gate structure
- trench isolation structure
- triple-diffusion structure
- triple-poly structure
- twin-well structure
- ultra-small structure
- unipolar structure
- van der Pauw structure
- vertical injector structure
- vertically integrated structure
- V-groove structure
- wafer асceptance test structure
- wiring layer structure
- zinc blende structureEnglish-Ukrainian dictionary of microelectronics > structure
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11 doping
легування. Технологія модифікації матеріалу додаванням домішки. - atomic layer doping
- background doping
- control doping
- counter doping
- double doping
- droplet-migration doping
- erratic doping
- field охide doping
- heavy [high] doping
- implantation doping
- implant doping
- injection doping
- interstitial doping
- ion-implantationdoping
- ion-implantdoping
- ion-shower doping
- laser doping
- lifetime-killer doping
- localized doping
- low-concentration doping
- low doping
- modulation doping
- neutron-transmutationdoping
- neutrondoping
- photochemical doping
- plasma doping
- post-охidation doping
- preferential doping
- proximity doping
- sheet doping
- shower doping
- solute doping
- substitutional doping
- transmutation doping
См. также в других словарях:
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