-
1 aligner
установка суміщення (і експонування); установка літографії- automaskaligner- autoaligner
- contact aligner
- deep-UV projection aligner
- diffusion tube aligner
- direct step-onto-wafer aligner
- electron-beam aligner
- full-field mask aligner
- full-field aligner
- hard-contact aligner
- mask aligner
- projection aligner
- proximity aligner
- reduction projection aligner
- site aligner
- soft-contact aligner
- step-and-repeat aligner
- step-by-step aligner
- stepper aligner
- shadow projection mask aligner
- shadow mask aligner
- submicron mask aligner
- submicron aligner
- wafer aligner
- wafer-stepping aligner
- X-ray aligner -
2 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
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3 level
1. ім.1) рівень2) ступінь (напр. інтеграції)2. дієсл. вирівнювати, розрівнювати - acceptor energy level
- algorithmic level
- allowed level
- automation level
- behavioral level
- chip complexity level
- chip level
- circuit level
- circuit complexity level
- complexity level
- concentration level
- confidence level
- damage level
- dc level
- deep level
- defect level
- degenerate level
- discrete energy level
- discrete level
- donor energy level
- doping level
- dynamic level
- electrical level
- electron quasi-Fermi level
- empty level
- filled level
- functional level
- functionality level
- gate level
- hole quasi-Fermi level
- impurity level
- input level
- integration level
- interconnection level
- logic level
- logical one level
- logical zero level
- logic gate level
- mask level
- masking level
- metallization level
- noise level
- occupied level
- register transfer level
- resistivity level
- saturation level
- shallow level
- sheet-resistance level
- steady-state level
- submicron level
- superficial level
- switch level
- transistor switch level
- trapping level
- TTL level
- two-resist level
- unfilled level
- unknown logic level
- vacant level
- wafer level -
4 lithography
(мікро) літографія. Процес перенесення малюнка на поверхню пластини за допомогою світлового випромінювання (photolithography), потоку електронів або рентгенівського випромінювання (X-ray lithography) - charged-particle lithography
- contact lithography
- contactless lithography
- contrast-enhanced lithography
- deep-UV lithography
- direct growth lithography
- direct-write electron-beam lithography
- dot lithography
- dual-surface lithography
- electron-beam lithography
- electron lithography
- excimer laser lithography
- fine-line lithography
- focused ion-beam lithography
- full-wafer lithography
- bard-contact lithography
- high-resolution lithography
- high-voltage EB lithography
- holographic lithography
- hybrid lithography
- i-line lithography
- ion-beam lithography
- laser-basedlithography
- laserlithography
- lift-off lithography
- mask lithography
- maskless lithography
- micrometer micron lithography
- micron lithography
- molecular-level lithography
- optical lithography
- positive-resist projection lithography
- precise registration lithography
- projection lithography
- proximity lithography
- raster-scan electron-beam lithography
- resistless lithography
- scaled-down lithography
- scanning electron-beam lithography
- scanning ion-beam lithography
- self-aligned dual-surface lithography
- soft lithography
- soft-contact lithography
- step-and-repeat lithography
- step-on-wafer lithography
- stepper lithography
- submicron lithography
- synchrotron-radiationlithography
- synchrotronlithography
- ultraviolet lithography
- vector-scan electron-beam lithography
- wafer lithography
- wafer-stepper lithography
- write e-beam lithography
- X-ray lithographyEnglish-Ukrainian dictionary of microelectronics > lithography
См. также в других словарях:
Schrägbeleuchtung — (englisch off axis illumination) – seltener Schrägbelichtung oder außeraxiale Belichtung genannt – bezeichnet in der Halbleitertechnik ein fortgeschrittenes Belichtungsverfahren bei der fotolithografischen Strukturierung. Es bietet die… … Deutsch Wikipedia
DSM — or dsm may refer to: Contents 1 Business 2 Computing 3 Military 4 … Wikipedia
Chemical-mechanical planarization — Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Contents 1 Description 2… … Wikipedia
Chipdesign — Chipentwurf (oder Chipentwicklung) bezeichnet den Prozess der Entwicklung eines Mikrochips von der ersten Idee über die Spezifikation und Umsetzung in einen Schaltplan und ein Layout bis zum gefertigten Chip. Inhaltsverzeichnis 1 Entwurfsmethoden … Deutsch Wikipedia
Chipentwurf — (oder Chipentwicklung) bezeichnet in der Mikroelektronik den Prozess der Entwicklung eines Mikrochips von der ersten Idee über die Spezifikation und Umsetzung in einen Schaltplan und ein Layout bis zum gefertigten Schaltkreis. Inhaltsverzeichnis… … Deutsch Wikipedia
Geschwindigkeitssättigung — Die Geschwindigkeitssättigung (englisch velocity saturation) bezeichnet einen der Kurzkanaleffekte bei Feldeffekttransistoren (FETs). Bei hohen Drainspannungen oder kleiner Kanallänge ( ) wird das longitudinale elektrische Feld E im Kanal… … Deutsch Wikipedia
LOCOS-Prozess — LOCOS, kurz für englisch Local Oxidation of Silicon (dt. »lokale Oxidation von Silicium«, ist in der Halbleitertechnik ein Verfahren zur elektrischen Isolation von Bauelementen (meist Transistoren). Dafür wird der Silicium Wafer an… … Deutsch Wikipedia
Velocity saturation — Die Geschwindigkeitssättigung (engl. velocity saturation) bezeichnet einen der Kurzkanaleffekte bei Feldeffekttransistoren (FETs). Bei hohen Drainspannungen oder kleiner Kanallänge ( ) wird das longitudinale elektrische Feld E im Kanal sehr groß … Deutsch Wikipedia
Negative bias temperature instability — (NBTI) is a key reliability issue in MOSFETs. It is of immediate concern in p channel MOS devices, since they almost always operate with negative gate to source voltage; however, the very same mechanism affects also nMOS transistors when biased… … Wikipedia
Химико-механическая планаризация — Причина введения CMP: слева показан срез чип … Википедия
UDSM — abbr. Ultra Deep Submicron … Dictionary of abbreviations