-
1 lithography
(мікро) літографія. Процес перенесення малюнка на поверхню пластини за допомогою світлового випромінювання (photolithography), потоку електронів або рентгенівського випромінювання (X-ray lithography) - charged-particle lithography
- contact lithography
- contactless lithography
- contrast-enhanced lithography
- deep-UV lithography
- direct growth lithography
- direct-write electron-beam lithography
- dot lithography
- dual-surface lithography
- electron-beam lithography
- electron lithography
- excimer laser lithography
- fine-line lithography
- focused ion-beam lithography
- full-wafer lithography
- bard-contact lithography
- high-resolution lithography
- high-voltage EB lithography
- holographic lithography
- hybrid lithography
- i-line lithography
- ion-beam lithography
- laser-basedlithography
- laserlithography
- lift-off lithography
- mask lithography
- maskless lithography
- micrometer micron lithography
- micron lithography
- molecular-level lithography
- optical lithography
- positive-resist projection lithography
- precise registration lithography
- projection lithography
- proximity lithography
- raster-scan electron-beam lithography
- resistless lithography
- scaled-down lithography
- scanning electron-beam lithography
- scanning ion-beam lithography
- self-aligned dual-surface lithography
- soft lithography
- soft-contact lithography
- step-and-repeat lithography
- step-on-wafer lithography
- stepper lithography
- submicron lithography
- synchrotron-radiationlithography
- synchrotronlithography
- ultraviolet lithography
- vector-scan electron-beam lithography
- wafer lithography
- wafer-stepper lithography
- write e-beam lithography
- X-ray lithographyEnglish-Ukrainian dictionary of microelectronics > lithography
-
2 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process
См. также в других словарях:
Micrometer — This article is about the measuring device. For the unit of length, see Micrometre. Outside, inside, and depth micrometers A micrometer ( … Wikipedia
Quantum point contact — A Quantum Point Contact (QPC) is a narrow constriction between two wide electrically conducting regions, of a width comparable to the electronic wavelength (nano to micrometer). Quantum point contacts were first reported in 1988 by a Dutch group… … Wikipedia
контактный — 2.3.3.10 контактный узел: Элемент или комбинация контактных элементов, которые могут быть объединены с подобными элементами, приводимыми в действие общим механизмом передачи. Источник … Словарь-справочник терминов нормативно-технической документации
ГОСТ 21830-76: Приборы геодезические. Термины и определения — Терминология ГОСТ 21830 76: Приборы геодезические. Термины и определения оригинал документа: 50. Алидада D. Alhidade F. Alidade Определения термина из разных документов: Алидада 80. Ампула уровня D. Röhre E. Level vial F. Fiole de niveau… … Словарь-справочник терминов нормативно-технической документации
контактный микрометр геодезического прибора — контактный микрометр Окулярный микрометр геодезического прибора с электроконтактным приспособлением, фиксирующим моменты прохождения нитей сетки через изображение подвижного объекта в поле зрения визирного устройства. [ГОСТ 21830 76] Тематики… … Справочник технического переводчика
Контактный микрометр геодезического прибора — 60. Контактный микрометр геодезического прибора Контактный микрометр D. Kontaktmikrometer der Zielvorrichtung E. Contact micrometer Окулярный микрометр геодезического прибора с электроконтактным приспособлением, фиксирующим моменты прохождения… … Словарь-справочник терминов нормативно-технической документации
Caliper — For other uses, see Caliper (disambiguation). A vernier caliper … Wikipedia
Transparency and translucency — Diaphanes redirects here. For the genus of firefly, see Diaphanes (beetle). Translucence redirects here. For other uses, see Translucence (disambiguation). Translucent redirects here. For the Japanese manga series, see Translucent (manga).… … Wikipedia
Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of … Wikipedia
Richard Towneley — (10 October 1629 – 22 January 1707) was an English mathematician and astronomer from Towneley near Burnley, Lancashire. He was one of a group of seventeenth century astronomers in the north of England, which included Jeremiah Horrocks, William… … Wikipedia
NanoFoil — is the trademarked name for a reactive multi layer foil material, sometimes referred to as a pyrotechnic initiator of two mutually reactive metals, aluminium and nickel, sputtered to form thin layers to create a laminated foil. On initiation by a … Wikipedia