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1 chip-carrier assembly
монтаж кристалів на кристалоносіїEnglish-Ukrainian dictionary of microelectronics > chip-carrier assembly
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2 assembly
1) збірка; монтаж 2) збірка; вузол - beam tape-automated assembly
- charge-shift assembly
- chip assembly
- chip-and-substrate assembly
- chip-carrier assembly
- chip-on-board assembly
- “cut and paste” assembly
- flip-chip assembly
- header assembly
- hybrid assembly
- microelectronic modular assembly
- molded assembly
- multichip assembly
- operating assembly
- semiconductor assembly
- step-by-step assembly
- surface-mounted assembly -
3 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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4 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
См. также в других словарях:
chip-carrier assembly — lustų surinkimas ant juostinio tiekiklio statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f… … Radioelektronikos terminų žodynas
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
Chipträgermontage — lustų surinkimas ant juostinio tiekiklio statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f… … Radioelektronikos terminų žodynas
assemblage sur le support de puce — lustų surinkimas ant juostinio tiekiklio statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f… … Radioelektronikos terminų žodynas
assemblage à la bande porteuse — lustų surinkimas ant juostinio tiekiklio statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f… … Radioelektronikos terminų žodynas
automatisches Chipbonden auf Trägerstreifen — lustų surinkimas ant juostinio tiekiklio statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f… … Radioelektronikos terminų žodynas
lustų surinkimas ant juostinio tiekiklio — statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f pranc. assemblage à la bande porteuse, m;… … Radioelektronikos terminų žodynas
сборка кристаллов ИС на ленточном носителе — lustų surinkimas ant juostinio tiekiklio statusas T sritis radioelektronika atitikmenys: angl. chip carrier assembly vok. automatisches Chipbonden auf Trägerstreifen, n; Chipträgermontage, f rus. сборка кристаллов ИС на ленточном носителе, f… … Radioelektronikos terminų žodynas
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia