-
1 style
-
2 circuit
схема; коло; контур (див. т-ж chip, integration) - air-isolation integrated circuit
- all-diffused circuit
- aluminum-gate MOS circuit
- aluminum-gate circuit
- amplifier integrated circuit
- analog integrated circuit
- AND circuit
- AND-OR circuit
- application specific integrated circuit
- array integrated circuit
- asymmetric-chevron bubble circuit
- asymmetric-chevron circuit
- basic circuit
- beam-leaded integrated circuit
- beam-lead integrated circuit
- bipolar circuit
- bipolar-FET integrated circuit
- breadboard circuit
- built-in self-checking monitoring circuit
- bulk-effect integrated circuit
- catalogue integrated circuit
- ceramic-encapsulated integrated circuit
- charge-coupled device circuit
- charge-coupled circuit
- charge-domain integrated circuit
- charge pumping circuit
- charge-transfer device circuit
- charge-transfer circuit
- chip integrated circuit
- CMOS circuit
- commodity integrated circuit
- common-base circuit
- common-collector circuit
- common-emitter circuit
- compatible integrated circuit
- complementary integrated circuit
- complex integrated circuit
- control integrated circuit
- crosspoint integrated circuit
- current mirror integrated circuit
- custom integrated circuit
- customized integrated circuit
- custom-wired integrated circuit
- Darlington-typecircuit
- Darlingtoncircuit
- dead-on-arrival integrated circuit
- dedicated -design circuit
- dedicated circuit
- depletion-mode integrated circuit
- die integrated circuit
- dielectrically-isolated integrated circuit
- digital integrated circuit
- digital sequential circuit
- diode-array integrated circuit
- discrete-chip integrated circuit
- discrete-component circuit
- discrete Fourier transform integrated circuit
- discrete integrated circuit
- distributed-element equivalent circuit
- domain-originated integrated circuit
- dry-processed integrated circuit
- dual in-line integrated circuit
- ECL circuit
- EFL integrated circuit
- elevated-electrode integrated circuit
- encapsulated integrated circuit
- enchancement-mode integrated circuit
- epitaxial integrated circuit
- epitaxial passivated integrated circuit
- equivalent circuit
- face-down integrated circuit
- fanout-free circuit
- fault-free circuit
- fault-tolerant circuit
- faulty circuit
- field-effect transistor integrated circuit
- field-effect integrated circuit
- field-programmable logic integrated circuit
- film-mounted integrated circuit
- fine-line integrated circuit
- fine-pattern integrated circuit
- flat-pack integrated circuit
- flip-chip integrated circuit
- flip-flop circuit
- front-end circuit
- full-custom integrated circuit
- functional integrated circuit
- gang-bonding integrated circuit
- gate-equivalent circuit
- governor integrated circuit
- guard-ring isolated integrated circuit
- Gunn-effect integrated circuit
- heterointegrated circuit
- high-density integrated circuit
- highly integrated circuit
- high-performance circuit
- high-speed integrated circuit
- high-technology integrated circuit
- high-threshold logic circuit
- high-volume circuit
- home-grown integrated circuit
- homointegrated circuit
- hybrid circuit
- hybrid dielectric integrated circuit
- hybrid film [hybrid-type] circuit
- I2L circuit
- infra-red integrated circuit
- insulated-substrate integrated circuit
- integrated circuit
- interface circuit
- isoplanar-based integrated circuit
- Josephson-junctioncircuit
- Josephsoncircuit
- ion-implanted integrated circuit
- junction isolated integrated circuit
- known-good circuit
- ladder-like circuit
- ladder circuit
- laminated integrated circuit
- large-scale integrated circuit
- leading-edge integrated circuit
- linear integrated circuit
- LOCOS integrated circuit
- logic integrated circuit
- low-noise circuit
- low-profile integrated circuit
- LSI circuit
- lumped-element equivalent circuit
- made-to-order integrated circuit
- master-slice integrated circuit
- matrix integrated circuit
- megascale integrated circuit
- MOSBIP integrated circuit
- memory circuit
- merchant integrated circuit
- merged integrated circuit
- microelectronic circuit
- Micronor integrated circuit
- micron-scale integrated circuit
- microprocessor integrated circuit
- molecular integrated circuit
- monobrid circuit
- monolithic circuit
- MOS-transistor circuit
- MOS circuit
- MSI circuit
- multichip circuit
- multilayer integrated circuit
- multilevel integrated circuit
- multiple-chip circuit
- naked integrated circuit
- NAND circuit
- noise-immunity integrated circuit
- nonredundant integrated circuit
- NOR circuit
- off-the-shelf integrated circuit
- one-chip integrated circuit
- one-mask integrated circuit
- open-collector integrated circuit
- optical integrated circuit
- optoelectronic integrated circuit
- OR circuit
- oxide-isolated integrated circuit
- partially self-checking circuit
- photo-integrated circuit
- photonic integrated circuit
- planar integrated circuit
- planar-mounted integrated circuit
- plastic encapsulated integrated circuit
- plastic integrated circuit
- p-n junction isolated integrated circuit
- polymer thick-film circuit
- prediffused integrated circuit
- programmable integrated circuit
- proprietary integrated circuit
- quick Fourier transform circuit
- race-free circuit
- radiation-hardened integrated circuit
- RС circuit
- redundant integrated circuit
- refreshing circuit
- refresh circuit
- sample-hold circuit
- scaled integrated circuit
- scan design circuit
- schematic circuit
- Schottky TTL integrated circuit
- Schottky TTL circuit
- screen-printed integrated circuit
- sealed-junction integrated circuit
- self-aligned integrated circuit
- self-cased LSI circuit
- self-checking [self-testing] integrated circuit
- semiconductor circuit
- semicustom integrated circuit
- semicustomized integrated circuit
- S/H circuit
- single-chipcircuit
- singlecircuit
- skimming-and-reset circuit
- slice circuit
- small-integration circuit
- smart-power integrated circuit
- SOI integrated circuit
- solid-state integrated circuit
- solid integrated circuit
- SOS integrated circuit
- stacked circuit
- standard сеll-based semicustom integrated circuit
- Strassen algorithm LSI circuit
- stripline integrated circuit
- submicron integrated circuit
- subnanosecond integrated circuit
- superconducting integrated circuit
- superconductor integrated circuit
- surface-mounted integrated circuit
- test-manufactured integrated circuit
- thick-film hybrid integrated circuit
- thick-film integrated circuit
- thin-film hybrid integrated circuit
- thin-film integrated circuit
- three-diffusion integrated
- three-dimensional integrated circuit
- transistor circuit
- tri-mask integrated circuit
- UHSI circuit
- uncommitted integrated circuit
- unipolar integrated circuit
- user specified integrated circuit
- vacuum integrated circuit
- VHSI circuit
- VLSI circuit
- wafer-scale integrated circuit
- wired OR circuit
- 3D integrated circuit -
3 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
-
4 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
5 desiccant
осушувач design 1. ім.1) проектування; розробка; конструювання2) проект; розробка; конструкція; схема2. дієсл. проектувати; розробляти; конструювати - automated desiccant
- automatic desiccant
- bipolar desiccant
- block desiccant
- bottom-up desiccant
- bottom-up building-block desiccant
- built-in-test desiccant
- chip desiccant
- circuit desiccant
- computer-aided desiccant CAD
- computer-aided desiccant
- computer-assisted desiccant CAD
- computer-assisted desiccant
- custom desiccant
- damage-tolerant desiccant
- detailed desiccant
- device desiccant
- discrete-circuit desiccant
- dynamic desiccant
- engineering desiccant
- fault-tolerant desiccant
- flat desiccant
- flat logic desiccant
- foundry desiccant
- front-end desiccant
- functional desiccant
- geometry desiccant
- hierarchical desiccant
- high-level desiccant
- high-performance desiccant
- IC desiccant
- in-house custom desiccant
- level-sensitive scan desiccant
- logic desiccant
- manual desiccant
- mask desiccant
- modular desiccant
- multichip [multiple-chip] desiccant
- on-line desiccant
- operational desiccant
- option desiccant
- package desiccant
- PC board desiccant
- physical desiccant
- process desiccant
- random-logic desiccant
- regular-logic desiccant
- scan path desiccant
- standard-cell desiccant
- structured desiccant
- substrate desiccant
- system-level desiccant
- target desiccant
- testing desiccant
- top-down desiccant
- topological layout desiccant
- transistor desiccant
- trial and error desiccant
- worst-case desiccantEnglish-Ukrainian dictionary of microelectronics > desiccant
-
6 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
-
7 yield
1) вихід годних 2) вихід; віддача - chip yield
- chip-separation yield
- circuit yield
- design yield
- dice yield
- isodefect yield
- percentage yield
- per-slice yield
- probe yield
- screening yield
- slice yield
- wafer yield -
8 package
1) корпус 2) монтаж в корпус, корпусування, вмонтовувати в корпус, корпусувати (див. т-ж раск) 3) упаковка; збірка; модуль; блок 4) пакет програм - cerdip package
- chip package
- consistent planar package
- controlled impedance package
- custom package
- design automation software package
- discrete-component package
- dual in-line package
- epoxy package
- flat-раск package
- glass-frit package
- grid array-pinned package
- impact-extruded package
- laminated package
- leadless package
- low-profile package
- metal-can package
- molded package
- multilayer package
- multipin package
- multiple-in-line package
- optimization package
- pin-grid array package
- planar package
- platform package
- plug-in package
- quad flat package
- quad in-line package
- silver-based package
- single in-line package
- SLAM package
- small-outline package
- small-outline transistor package
- SMD package
- tape automated bonding package
- transistor-outline package
- window-frame package
- zigzag-in-line ZIL package
- zigzag-in-line package
См. также в других словарях:
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chip design — lusto projektavimas statusas T sritis radioelektronika atitikmenys: angl. chip design vok. Chip Design, n; Chip Entwurf, m rus. проектирование кристалла ИС, n pranc. conception de puce, f … Radioelektronikos terminų žodynas
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Design for testing — Design for Test (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and… … Wikipedia
Design For Test — (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and apply… … Wikipedia
Chip-Entwurf — lusto projektavimas statusas T sritis radioelektronika atitikmenys: angl. chip design vok. Chip Design, n; Chip Entwurf, m rus. проектирование кристалла ИС, n pranc. conception de puce, f … Radioelektronikos terminų žodynas
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Chip Foose — at SEMA Born October 13, 1963 (1963 10 13) (age 48) Santa Barbara, California, United States … Wikipedia
Chip Foose — (* 13. Oktober 1963 in Santa Barbara, Kalifornien) ist ein amerikanischer Fahrzeugtuner, designer und bauer. Er betreibt einen Hot Rod Shop und ist Star der Serie „Overhaulin’“, die unter Anderem auf dem TV Sender DMAX ausgestrahlt wird … Deutsch Wikipedia
Design rule checking — or Check(s) (DRC) is the area of Electronic Design Automation that determines whether the physical layout of a particular chip layout satisfies a series of recommended parameters called Design Rules. Design rule checking is a major step during… … Wikipedia
Chip Foto-Video — Beschreibung Fotomagazin Verlag CHIP Communications Erstausgabe 2003 … Deutsch Wikipedia