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1 Chemical Mechanical Planarization
Chemistry: CMPУниверсальный русско-английский словарь > Chemical Mechanical Planarization
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2 химико-механическая полировка
химико-механическая полировка
химико-механическое выравнивание
Метод удаления слоев твердого тела с помощью химико-механической полировки, выполняемой с целью выравнивания поверхности и выявления конфигурации межметаллических соединений; ключевой заключительный процесс поточного производства интегральных микросхем.
[ http://www.cscleansystems.com/glossary.html]Тематики
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Русско-английский словарь нормативно-технической терминологии > химико-механическая полировка
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3 химико-механическое выравнивание поверхности или полирование
Универсальный русско-английский словарь > химико-механическое выравнивание поверхности или полирование
См. также в других словарях:
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Chemisch-mechanische Politur — Chemisch mechanisches Polieren (CMP) (engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um sehr dünne Schichten gleichmäßig abzutragen. Diese Methode wurde an US… … Deutsch Wikipedia
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