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1 bonding wire
дротяний вивід, приєднаний методом термокомпресіїEnglish-Ukrainian dictionary of microelectronics > bonding wire
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2 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
3 wire
1. ім. 1) дріт; провідник; шина 2) дріт; (дротяне) з’єднання 2. дієсл. 1)формувати (дротяні) з’єднання; формувати розводку 2) вмонтовувати - bit wire
- bonding wire
- connected wires
- jumper wire
- lead wire
- overflow wires
- quantum wire
- tinned wire
- wrapped wire -
4 wire bonding
1) приєднання дротяних виводів; дротяний монтаж2) дротяне термокомпресійне зварюванняEnglish-Ukrainian dictionary of microelectronics > wire bonding
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5 wire-bonding technique
метод дротяного монтажуEnglish-Ukrainian dictionary of microelectronics > wire-bonding technique
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6 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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7 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder -
8 machine
- axial lead taping machine
- back-end machine
- bending machine
- bonding machine
- byte machine
- cassette-to-cassette machine
- character machine
- charging machine
- component taping machine
- coordinate plotting machine
- data flow machine
- degrutting machine
- deterministic Turing machine
- deterministic machine
- EBL machine
- finite-state machine
- front-end machine
- generalized sequential machine
- gold dotting machine
- high-реrformance machine
- insertion machine
- ion-beam machine
- lapping machine
- lead-forming machine
- limited register machine
- linear sequential machine
- loading machine
- logic simulation machine
- Mealy machine
- molding machine
- Moor machine
- MOS machine
- multiple step-and-repeat machine
- nondeterministic sequential machine
- photocomposition machine
- pick-and-place machine
- pipelined machine
- planar machine
- plasma-etch machine
- plotting machine
- polishing machine
- powder-coating machine
- projection machine
- reference machine
- scribing machine
- sequencing machine
- single step-and-repeat machine
- software-controlled/ machine
- sorting machine
- stack machine
- step-and-repeat machine
- stuffing machine
- transfer molding machine
- transfer machine
- vector-scan electron-beam machine
- welding machine
- wire-routing machine
- wire-wrap machine
- x-y plotting machine -
9 tool
1) інструмент; пристосування; оснащення (напр. фотошаблону) 2) устаткування; верстат 3) піддавати механічній обробці 4) pl (інструментальні) засоби - antistatic tool
- artwork checking tool
- bonding tool
- CAD tools
- CAE/CAD tools
- computer-aided tool
- computer-aided engeneering tools
- computer-based design tools
- design synthesis tools
- desoldering tool
- diamond scribe tool
- DIP/IC insertion tool
- extraction tool
- hand tool
- insertion tool
- lead-forming tool
- lithography tool
- mask inspection tool
- physical layout tools
- pick-up tool
- placement tool
- process characterization tool
- scribing tool
- software tools
- soldering tool
- sputtering tool
- step-and-repeat tool
- wafer-reading tool
- wire-wrapping tool
- work tool
См. также в других словарях:
bonding wire — termokompresinio suvirinimo viela statusas T sritis radioelektronika atitikmenys: angl. bonding wire vok. Bonddraht, m rus. проволока для термокомпрессионной сварки, f pranc. fil pour soudage à thermocompression, m … Radioelektronikos terminų žodynas
bonding wire lead — termokompresiškai prijungtas vielinis išvadas statusas T sritis radioelektronika atitikmenys: angl. bonding wire lead vok. Bonddrahtanschluß, m rus. проволочный вывод, присоединённый методом термокомпрессии, m pranc. sortie en fil connectée par… … Radioelektronikos terminų žodynas
Wire bonding — is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.The wire is generally made up of one of the following: *Gold *Aluminum *CopperWire diameters start at 15 µm and can be up … Wikipedia
Wire bonding — es el método más usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del método wire bonding no se limita sólo a este tipo de conexiones, ya que también se puede… … Wikipedia Español
Bonding-studenteninitiative e.V. — The bonding studenteninitiative e.V. (short name bonding ) is an independent, non political and non profit student organisation. It was founded in 1988 in Aachen, Germany. The name derives from wire bonding, where interconnections between a… … Wikipedia
Bonding jumper — A bonding jumper is a reliable conductor to ensure the required electrical conductivity between metal parts required to be electrically connectedcite book | last = edited by Robert H. Griffin | title = Safety and Health Requirements Manual: U. S … Wikipedia
wire bonding — termokompresinis vielos prijungimas statusas T sritis radioelektronika atitikmenys: angl. wire bonding vok. Drahtbonden, n rus. проволочная термокомпрессия, f; термокомпрессионное присоединение проволочных выводов, n pranc. soudage à… … Radioelektronikos terminų žodynas
wire bonding — vielinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. wire bonding vok. Drahtbondung, f rus. присоединение проволочных выводов, n pranc. connexion des sorties en fil, f … Radioelektronikos terminų žodynas
Wire bonding — Das Drahtbonden (von engl. bond Verbindung , Haftung ) bezeichnet in der Elektronik Fertigung einen Verfahrensschritt, bei dem mittels dünner Drähte (Bonddraht) ein Chip (engl. die, zum Beispiel ein integrierter Schaltkreis, eine Leuchtdiode, ein … Deutsch Wikipedia
Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
Electrical bonding — is the practice of intentionally electrically connecting all metallic non current carrying items in a room or building as protection from electric shock. If a failure of electrical insulation occurs, all metal objects in the room will have the… … Wikipedia
