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1 ball bonding
термокомпресійне зварювання кулькою, кулькова термокомпресіяEnglish-Ukrainian dictionary of microelectronics > ball bonding
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2 gold ball bonding
кулькова термокомпресійне зварювання золотого дротуEnglish-Ukrainian dictionary of microelectronics > gold ball bonding
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3 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
4 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder
См. также в других словарях:
Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
ball bonding — rutulinis termokompresinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. ball bonding; nail head bonding; thermocompression ball bonding vok. Nagelkopfbondverfahren, n; Nailheadbonding, n; Thermokompressionskugelbonden, n rus … Radioelektronikos terminų žodynas
thermocompression ball bonding — rutulinis termokompresinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. ball bonding; nail head bonding; thermocompression ball bonding vok. Nagelkopfbondverfahren, n; Nailheadbonding, n; Thermokompressionskugelbonden, n rus … Radioelektronikos terminų žodynas
gold ball bonding — rutulinis termokompresinis aukso vielos prijungimas statusas T sritis radioelektronika atitikmenys: angl. gold ball bonding vok. Goldnagelkopfbonden, n rus. шариковое термокомпрессионное присоединение золотой проволоки, n pranc. thermocompression … Radioelektronikos terminų žodynas
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Ball screw — A ball screw is a mechanical device for translating rotational motion to linear motion. A threaded shaft provides a spiral raceway for ball bearings which act as a precision screw. As well as being able to apply or withstand high thrust loads… … Wikipedia
ball clay — noun Etymology: from its formation into balls for transport from the mines : a very plastic high firing clay that fires white to light buff and is used especially to give plasticity to clayware bodies containing short clays * * * Ceram. a fine… … Useful english dictionary
ball clay — Ceram. a fine dark kaolinic clay that turns white or nearly white when fired, used in the manufacture of a wide variety of ceramic wares in combination with other clays for its exceptional bonding properties and plasticity. [1805 15] * * * … Universalium
Wire bonding — is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.The wire is generally made up of one of the following: *Gold *Aluminum *CopperWire diameters start at 15 µm and can be up … Wikipedia
nail-head bonding — rutulinis termokompresinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. ball bonding; nail head bonding; thermocompression ball bonding vok. Nagelkopfbondverfahren, n; Nailheadbonding, n; Thermokompressionskugelbonden, n rus … Radioelektronikos terminų žodynas
Wire bonding — es el método más usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del método wire bonding no se limita sólo a este tipo de conexiones, ya que también se puede… … Wikipedia Español