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Sputter cleaning

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  • Sputter cleaning — is the cleaning of a solid surface in a vacuum by using physical sputtering of the surface. Sputter cleaning is often used in vacuum deposition and ion plating. In 1955 Farnsworth, Schlier, George, and Burger reported using sputter cleaning in an …   Wikipedia

  • Parts cleaning — is essential to many industrial processes, as a prelude to surface finishing or to protect sensitive components. Electroplating is particularly sensitive to part cleanliness, since molecular layers of oil can prevent adhesion of the coating. ASTM …   Wikipedia

  • Teilereinigung — Gewerbliche und industrielle Teilereinigung beschäftigt sich mit der Entfernung unerwünschter Schichten von den zu reinigenden Teilen, um die Qualität von Folgeprozessen wie etwa Farbbeschichten, Galvanisieren, Härten etc. sicherzustellen.… …   Deutsch Wikipedia

  • Ion source — An ion source is an electro magnetic device that is used to create charged particles. These are used primarily within mass spectrometers or particle accelerators.Mass spectrometry In mass spectrometry, an ion source is a piece of equipment used… …   Wikipedia

  • Vacuum deposition — Not to be confused with Vacuum coating. Vacuum deposition is a family of processes used to deposit layers atom by atom or molecule by molecule at sub atmospheric pressure (vacuum) on a solid surface. The layers may be as thin as one atom to… …   Wikipedia

  • Helium atom scattering — (HAS) is a surface analysis technique used in materials science. HAS provides information about the surface structure and lattice dynamics of a material by measuring the diffracted atoms from a monochromatic helium beam incident on the sample.… …   Wikipedia

  • Ohmic contact — An ohmic contact is a region on a semiconductor device that has been prepared so that the current voltage (I V) curve of the device is linear and symmetric. If the I V characteristic is non linear and asymmetric, the contact is not ohmic, but is… …   Wikipedia

  • Scanning electron microscope — These pollen grains taken on an SEM show the characteristic depth of field of SEM micrographs …   Wikipedia

  • Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …   Wikipedia

  • Thin film — A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Electronic semiconductor devices and optical coatings are the main applications benefiting from thin film construction. A… …   Wikipedia

  • Ion plating — is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a version of vacuum deposition . Ion plating utilizes concurrent or periodic bombardment of the substrate and …   Wikipedia


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