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1 processing
1) (технологічна) обробка; проведення процесу 2) технологія (див. т-ж process, technique, technology) 3) обробка (інформації) - array processing
- batch-modeprocessing
- batchprocessing
- beam processing
- bipolar processing
- chip processing
- CMOS/SOS processing
- component pre-insertion processing
- component processing
- computer word processing
- digital image processing
- dry processing
- electroless processing
- electron-beam processing
- epitaxial processing
- excimer laser processing
- exposive-shock processing
- fabrication processing
- hands-off processing
- high-resolution processing
- high-temperature processing
- high-volume processing
- high-yield processing
- image processing
- in-line processing
- ion-beam processing
- ion-implantation processing
- isothermal processing
- laser cold processing
- liquid chemical processing
- liquid processing
- lithographic processing
- maskless processing
- microelectronic processing
- microgravity processing
- MOS processing
- multimask processing
- multi-User MEMS processing MUMPS
- multi-User MEMS processing
- multiple-chemical processing
- on-line data processing
- pel-to-pel processing
- photochemical processing
- photoresist processing
- pipeline processing
- planar processing
- planar plasma processing
- plasma processing
- post ion-implantation processing
- pyrolytic laser processing
- radiation-free processing
- relief-mask processing
- single-wafer semiconductor processing
- single-wafer processing
- slice-at-a-time processing
- space semiconductor processing
- submicrometer processing
- submicron processing ї
- TAB processing
- temperature-gradient zone-melting processing
- thermal processing
- unattended processing
- vacuum infrared processing
- vertical processing
- wafer-by-wafer processing
- wet chemical processing
- wet processingEnglish-Ukrainian dictionary of microelectronics > processing
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2 slice-at-a-time processing
одинична обробка пластин (на відміну від групової)English-Ukrainian dictionary of microelectronics > slice-at-a-time processing
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3 array
1) матриця; матрична ІС 2) структура 3) масив 4) таблиця 5) вектор - bulk CMOS array
- cell array
- channel-free gate array
- channelless gate array
- charge-coupled-devicearray
- charge-coupledarray
- circuit array
- coupled quantum box array
- customizable array
- data array
- diode array with self-scanning
- drop-in test array
- FET array
- field-programmable gate array
- fuse-link array
- fuse-programmable array
- gate array
- IC array
- image array
- large-scale array
- laser-scanning array
- lateral array
- linear array
- logic array
- Macrocell array
- mask-programmable array
- master slice array
- master-slice gate [master-slice logic] array
- memory array
- mesa p-n diode array
- microcell array
- monolithic array
- multichip array
- multistrip array
- n-channel MOS array
- negative MOS array
- nonoverlapping redundant array
- original image data array
- original subimage data array
- pattern array
- p-channel MOS array
- pin-grid array
- polycell array
- processing array
- programmable gate array
- programmable logic array
- register array
- semiconductor array
- semicustom array
- Schottky-cellarray
- Schottkyarray
- Schottky TTL gate array
- single-layer metal array
- SOS array
- standardized array
- storage logic array
- structured array
- systolic array
- tiledarray
- tilearray
- uncommitted logic array
- universal array
- wafer-scale array
- x-y array
- 2D quantum box array -
4 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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5 approach
метод; підхід (див. також method, mode, technique) - bipolar approach
- bottom-up approach
- Bristle Blocks approach
- building-block approach
- cassette-to-cassette approach
- cellular approach
- cermet approach
- chip-and-wire approach
- circuit motivated approach
- custom approach
- customized approach
- divide and conquer» approach
- edge-based approach
- epic approach
- figure-based approach
- fixed-interconnection pattern approach
- flat approach
- flip-chip approach
- gate-array approach
- hierarchical approach
- hierarchical nesting approach
- hundred per cent yield approach
- hybrid approach
- incremental approach
- in-line approach
- iterative-cell approach
- Macrocell approach
- master MOS approach
- master-slice approach
- mesa-epitaxial fabrication approach
- modular approach
- monolithic approach
- path-oriented approach
- planar processing approach
- planar approach
- polycell layout approach
- polycell approach
- sea gates approach
- selective field-oxide approach
- shaped-beam approach
- SOS approach
- standard cell-basedapproach
- standard cellapproach
- structured approach
- top-down approach
- twin-tub approach
- two-polysilicon approach
- waveform approach -
6 unit
1) пристрій; блок; установка 2) елемент (ІС); компонент; прилад - bipolar unit
- bus асcess unit
- carrier unit
- central processing unit
- control unit
- cut-and-form unit
- desoldering unit
- digital unit
- DIP unit
- discrete unit
- field-replaceable unit
- fume-extraction unit
- functional unit
- Gunn-effect unit
- Gunn unit
- hybrid unit
- individual unit
- integrated circuit unit
- interface unit
- lead-forming unit
- lead-frame unit
- lithography unit
- logic unit
- master-slice unit
- memory unit
- microcomputer unit
- nondedicated unit
- pilot production unit
- resist dispenser unit
- screened unit
- SMD assembly unit
- stand-alone unit
- standby unit
- supply unit
- vacuum-coating unit
- wafer-transfer unit
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