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1 beam tape
стрічковий носій з балковими виводамиEnglish-Ukrainian dictionary of microelectronics > beam tape
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2 beam tape packaging
збірка ІС на стрічковому носії з балковими виводамиEnglish-Ukrainian dictionary of microelectronics > beam tape packaging
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3 beam tape-automated assembly
автоматизована збірка ІС на стрічковому носії з балковими виводамиEnglish-Ukrainian dictionary of microelectronics > beam tape-automated assembly
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4 beam tape-automated (bonding) bonder
автоматизована пристрій для приєднання кристалів до балочних виводів на стрічковому носії (з вивідними рамками)English-Ukrainian dictionary of microelectronics > beam tape-automated (bonding) bonder
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5 beam tape-automated bonding
автоматизоване приєднання балкових виводів на стрічковому носії (з вивідними рамками)English-Ukrainian dictionary of microelectronics > beam tape-automated bonding
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6 beam tape-automated (bonding) bonder
автоматизована пристрій для приєднання кристалів до балочних виводів на стрічковому носії (з вивідними рамками)English-Ukrainian dictionary of microelectronics > beam tape-automated (bonding) bonder
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7 beam-tape microinterconnection equipment
устаткування для приєднання кристалів до балочних виводів на стрічковому носіїEnglish-Ukrainian dictionary of microelectronics > beam-tape microinterconnection equipment
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8 beam-tape technolog/y
технологія приєднання кристалів до балкових виводів на стрічковому носіїEnglish-Ukrainian dictionary of microelectronics > beam-tape technolog/y
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9 tape
1) стрічковий носій (вивідних рамок) 2) стрічка - beam tape
- blister tape
- bumped tape
- carrier tape
- checkout tape
- compliant bonding tape
- interconnect tape
- lead tape
- masking tape
- test tape
- transport tape -
10 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
11 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder -
12 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
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13 packaging
1) монтаж в корпусі, корпусування 2) збірка (і герметизація). Процес монтажу компонентів в контейнер, який має зовнішні межі для захисту компонентів - beamless tape packaging
- beam tape packaging
- bulk packaging
- chip packaging
- fluidized-bed packaging
- high-density packaging
- hybrid packaging
- integrated-circuit packaging
- plastic packaging
- static protective packaging
- wafer level packaging WLP
- wafer level packagingEnglish-Ukrainian dictionary of microelectronics > packaging
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14 assembly
1) збірка; монтаж 2) збірка; вузол - beam tape-automated assembly
- charge-shift assembly
- chip assembly
- chip-and-substrate assembly
- chip-carrier assembly
- chip-on-board assembly
- “cut and paste” assembly
- flip-chip assembly
- header assembly
- hybrid assembly
- microelectronic modular assembly
- molded assembly
- multichip assembly
- operating assembly
- semiconductor assembly
- step-by-step assembly
- surface-mounted assembly -
15 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
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16 BTAB bonder
English-Ukrainian dictionary of microelectronics > BTAB bonder
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17 chip
1) кристал (напр. ІС) 2) інтегральна схема, ІС; мікросхема (див. т-ж circuit, integration) 3) обколювати (напр. кристал) - array chip
- backbonded chip
- balls-down chip
- bare chip
- beam-leadedchip
- beam-leadchip
- bubble-domain chip
- bubble-memory chip
- bumped chip
- committed chip
- component chip
- contiguous-disk bubble chip
- contiguous-disk chip
- custom -built chip
- custom chip
- customizable chip
- dense chip
- discrete-device chip
- electronic chip
- face-down chip
- factory-programmable chip
- fast chip
- fault-free chip
- fault-tolerant chip
- flip chip
- full-wafer chip
- fuse-programmable chip
- gate-array chip
- glue chip
- heterogeneous chip
- highly-расked chip
- hybrid chip
- hyper chip
- IC chip
- individual circuit chip
- integrated-microcircuit chip
- mask-programmable chip
- master-slicechip
- masterchip
- master-slice logic chip
- memory chip
- micro chip
- microcircuit chip
- microprocessor chip
- monolithic chip
- multilead chip
- naked chip
- nongold backed chip
- opto chip
- packaged chip
- pedestal chip
- peripheral chip
- pipelined chip
- planar passivated chip
- Poly Use chip
- process-development chip
- process-validation chip
- resistor chip
- semiconductor chip
- SLS chip
- solder chip
- super chip
- support chip
- TAB chip
- test chip
- thick-film chip
- thin-film chip
- tolerant chip
- ultra chip
- uncommitted chip
- unpackaged chip
- wire-bonded chip
- XR chip
- X-ray made chip
- III-V chip -
18 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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19 lead
1. ім. (гнучкий) вивід (корпуса), електродний вивід; провідник 2. дієсл. проводити; виводити - axial lead
- base lead
- beam lead
- bonding lead
- bond lead
- bottom-brazed lead
- buried lead
- butt lead
- cantilevered lead
- collector lead
- compliant lead
- electroformed lead
- gold-plated lead
- guide lead
- gull wing lead
- j- lead
- open j- lead
- overhanging lead
- radial lead
- resilient lead
- ribbon lead
- side-brazed lead
- spider lead
- support lead
- tape-automated-bonded leads
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Zwischenträgermontage — automatinis lustų surinkimas ant juostinio tiekiklio su sijiniais išvadais statusas T sritis radioelektronika atitikmenys: angl. beam tape automated assembly vok. Montage von Halbleiterchips auf Zwischenträgerfilmen, f; Zwischenträgermontage, f… … Radioelektronikos terminų žodynas